Tool Design Engineer Location: Bangalore Department: Tool Design Designation: Engineer Tool Design About the Role Sansera Engineering is looking for a motivated and skilled Tool Design Engineer to join our dynamic team. The ideal candidate will be responsible for designing, developing, and testing tooling solutions that support efficient and high-quality manufacturing processes. This role requires close collaboration with production, quality assurance, and supply chain teams to ensure successful project execution and continuous improvement. Key Responsibilities Design and develop cutting tools and fixtures using AutoCAD and 3D modeling software. Select appropriate cutting tools based on process requirements and application. Create detailed engineering drawings including isometric views, GD&T, and basic fixtures. Conduct feasibility studies, perform engineering calculations, and analyze tooling costs (process cost, cycle time, tool cost per component). Troubleshoot issues related to cutting tools and machining processes to improve efficiency. Drive continuous improvements in machining and tooling processes. Prepare technical documentation, reports, and project specifications. Assist in project planning, scheduling, and meeting deadlines within budget constraints. Analyze performance data to optimize tool designs and manufacturing processes. Stay updated on the latest industry trends, technologies, and best practices. Ensure compliance with quality assurance standards and safety protocols. Skills and Qualifications Diploma or Bachelor s degree in Mechanical Engineering. 3 to 6 years of experience in tool design, preferably within a manufacturing or machining environment. Proficiency in AutoCAD and 3D CAD tools for tool design. Strong knowledge of cutting tool selection and machining processes. Familiarity with GD&T (Geometric Dimensioning and Tolerancing). Good understanding of manufacturing processes, materials, and cost optimization. Excellent analytical, problem-solving, and communication skills. Ability to collaborate effectively within cross-functional teams. Awareness of quality standards such as ISO and experience with quality assurance processes. Strong project management skills with the ability to handle multiple tasks concurrently. Opportunity to work with a leading engineering company specializing in high-precision automotive and aerospace components. Dynamic and supportive work environment that encourages innovation and professional growth. Involvement in cutting-edge tooling projects that impact global manufacturing operations. Qualification : Diploma or Bachelors degree in Mechanical Engineering

Job Title: Principal Electronics Engineer Embedded Hardware Location: Bengaluru Experience: 8 14 years Industry: Automotive / EV / Manufacturing Employment Type: Full-time About Ultraviolette Join the Charge. Create the Future. At Ultraviolette, we are more than just a company we re a movement that s reshaping the future of electric mobility. From building India s fastest electric motorcycle to designing the world s most advanced electric scooter, we thrive on pushing the boundaries of what s possible. We are a team of engineers, designers, and trailblazers united by a passion to craft machines that are sustainable, intelligent, and exhilarating. Every bolt, every line of code, and every component is designed with a singular mission: to accelerate the global shift toward next-generation mobility. Role Overview We are looking for a Principal / Lead Electronics Engineer Embedded Hardware to take ownership of vehicle electronics architecture, embedded systems design, diagnostics, and system-level validation for our next-gen electric vehicles. In this role, you will be at the forefront of developing high-performance electronic control units, telematics, and connected systems for future-ready vehicles. You will drive architecture decisions, system integration, and compliance, working alongside cross-functional teams to bring innovation from concept to the street. Key Responsibilities 1. Vehicle Electronics Architecture Design and bring to production electronic hardware including ECUs, display clusters, and telematics modules. Develop high-speed embedded designs with RF, sensor integration, and communication interfaces (CAN, LIN, UART, SPI, I2C). Create and maintain system schematics, architecture documentation, and interface definitions. 2. Embedded Hardware Design Develop embedded platforms with high-performance microcontrollers/processors to support vision systems, graphics, radar/LiDAR, audio, and OS-based applications. Architect and validate connected systems involving GNSS, LTE, BLE, Wi-Fi. Lead the design and integration of vehicle subsystems like lighting, clusters, IMUs, and more. Collaborate closely with firmware teams on hardware-software integration, bootloaders, and OTA functionality. 3. Diagnostics & Compliance Implement UDS-based diagnostics, fault logging systems, and service tools. Ensure compliance with AIS-004, ISO 26262, and other automotive design standards. 4. Testing & Validation Define and execute component-level and vehicle-level validation test plans. Utilize tools like Vector CANoe, CANalyzer, ETAS INCA, oscilloscopes, and spectrum/network analyzers for debugging and validation. 5. Cross-functional Collaboration Partner with teams across mechanical, software, UX, powertrain, and wire harness for holistic system integration. Work with mobile and cloud teams to enable real-time data streaming, diagnostics, and OTA updates. Actively contribute in design reviews, DFMEAs, and root cause analyses of field issues. Required Qualifications & Skills B.E. / M.E. / B.Tech / M.Tech in Electronics, Electrical, Mechatronics, or related disciplines. 8+ years of embedded hardware design experience, preferably in 2W/EV/automotive domain. Strong understanding of embedded C and scripting languages (e.g., Python, MATLAB, Octave). Experience with circuit simulation tools (e.g., PSPICE, LTSPICE, SIMPLIS, Simetrix). Hands-on expertise in RF design, signal/power integrity, EMI/EMC compliant layouts. Proficiency in PCB design tools (e.g., OrCAD, Altium, Mentor Graphics). Demonstrated experience in designing systems with multi-core processors, memory chips, SoMs, and high-speed interfaces (USB, Ethernet, LVDS, MIPI). Deep knowledge of embedded communication protocols (CAN, LIN, SPI, UART, I2C). Strong debugging and problem-solving skills in hardware validation and field testing. Nice to Have Hands-on experience in vehicle electronics development for 2W, 4W, or electric vehicles. Familiarity with DFT/DFA (Design for Testing/Assembly) methodologies. Experience with manufacturing and compliance testing for embedded hardware. Background in developing connected vehicle ecosystems with OTA capabilities. Passionate about emerging technologies in mobility, EVs, and embedded systems. Be part of India s electric mobility revolution where engineering meets adrenaline. Work on world-class technologies that are pushing global boundaries. Join a culture that encourages innovation, learning, and ownership. Collaborate with passionate teams building next-gen mobility experiences. Qualification : B.E. / M.E. / B.Tech / M.Tech in Electronics, Electrical, Mechatronics, or related disciplines

Job Title: Industrialization Engineer Location: Bengaluru, India Experience Required: 5 10 years Industry: Electronics / Electric Vehicles Employment Type: Full-time Company: Ultraviolette Automotive Pvt Ltd Join the Charge. Create the Future. At Ultraviolette, we are redefining mobility. From building India s fastest electric motorcycle to developing the world s most advanced electric scooter, we thrive on innovation, bold thinking, and performance that thrills. We're a diverse, passionate team of engineers, designers, and creators united by one mission: to build machines that are not only sustainable, but exhilarating. If you re driven by purpose and ready to shape the future of mobility, this is your moment. Role Overview: We are looking for a technically strong and hands-on Industrialization Engineer (Electronics) to lead the transition from R&D prototypes to scalable, high-quality mass production. In this cross-functional role, you will work at the intersection of design, manufacturing, sourcing, and embedded systems, ensuring our products are built for scale, reliability, and performance without compromising innovation. Key Responsibilities: Technical Ownership & Industrialization: Lead industrialization from EVT (Engineering Validation Test) to DVT (Design Validation Test) and PVT (Production Validation Test), up to mass production. Translate R&D designs into production-ready documentation (BOMs, Gerbers, PCBA specs, test jigs, etc.). Conduct Design for Manufacturability (DFM) and Design for Testability (DFT) reviews. Own ramp-up metrics such as yield, test coverage, defect trends, and field return analysis. Collaborate with R&D teams on thermal design, layout optimization, and component derating strategies. Ensure compliance with voltage isolation, creepage/clearance, and relevant safety standards. Supplier & EMS Collaboration: Act as a technical bridge between internal teams and EMS vendors, ensuring alignment from design to execution. Coordinate with EMS on NPI builds, process validation, line setup, and FAI (First Article Inspection). Support firmware flashing, version control, and hardware-software integration testing at production lines. Assist in troubleshooting mechanical, electrical, or firmware-related issues during production. Component Engineering & Cost Optimization: Evaluate and qualify alternate components and suppliers. Drive cost engineering and BOM optimization without compromising on quality. Engage in component lifecycle management and ensure availability through the production lifecycle. Required Qualifications & Skills: B.E./B.Tech in Electronics, Electrical, or related field 5 10 years experience in hardware industrialization, preferably in EV or electronics manufacturing Strong knowledge of PCB design reviews, SMT/PCBA processes, and box build Hands-on with tools like Altium, OrCAD, or similar for PCB-level evaluations Experience with ICT/FCT test setups, test fixture design, and test station validation Basic embedded systems understanding firmware flashing, serial log analysis, GPIO testing Experience working directly with EMS vendors, test labs, and component suppliers Excellent cross-functional communication skills Willing to travel to EMS or supplier sites for builds and validation Nice to Have (Preferred): Familiarity with FMEA, APQP, PPAP, ISO/IATF 16949 processes Knowledge of compliance and safety standards (e.g., IEC, ISO 26262) Background in value engineering, cost-down programs, and process audits Work on industry-defining EV products with world-class engineering challenges Collaborate with cutting-edge R&D and manufacturing teams Be part of a mission-led company that s changing the landscape of mobility A workplace culture that values ownership, audacity, and excellence Apply now and be a part of something bigger. Let s create the future together. Qualification : B.E./B.Tech in Electronics, Electrical, or related field

Job Title: Mechanical System Engineer - Robotics Location: Bengaluru Role and Responsibilities System Design & Integration: Analyze customer production lines to break down requirements and design mechanical systems integrating the CyRo platform. Ensure mechanical designs meet customer-specific constraints such as space, payload, and environmental conditions. Develop systems including CyRo, feeding mechanisms, sensors, fixtures, and other mechanical components for tailored automation solutions. Perform tolerance analysis to validate dimensional and functional requirements. Collaborate closely with electrical, software, and systems engineering teams to ensure seamless subsystem integration. Design mounting systems, fixtures, and interface components to facilitate integration into customer facilities when required. Mechanical Optimization: Optimize system designs by integrating mechanisms and sensors to enhance performance, modularity, and scalability. Select and design mechanisms for part presentation, feeding, reorientation, and manipulation considering space and performance constraints. Develop automation cells with modularity and scalability for current and future applications. Continuously refine workflows to improve cycle times, reduce errors, and increase operational efficiency. Modelling: Create and integrate detailed mechanical designs, including CAD layouts and fixtures, supporting customer automation solutions. Validate designs through tolerance analysis and develop calibration fixtures for robotic systems. Work cross-functionally to ensure mechanical designs integrate effectively with instrumentation, software, and controls. Documentation: Produce comprehensive documentation such as design specifications, validation reports, and scalability guidelines to ensure reproducibility. Develop detailed installation guides, maintenance manuals, and troubleshooting documentation for customer use. Skills and Experience Proficient in CAD software such as SolidWorks, CATIA, or AutoCAD. Strong grasp of mechanical engineering principles, materials science, and manufacturing processes. Experience in robotics, automation, or mechatronics is highly preferred. Familiarity with relevant industry standards and safety regulations (ISO, ANSI, OSHA). Excellent analytical, problem-solving, communication, and teamwork skills. Understanding of manufacturing processes, assembly lines, and automation cell design. Prior experience designing and integrating automation systems in production or process lines. Required Qualifications Bachelor s or Master s degree in Mechanical Engineering, Mechatronics, or related fields. Minimum 3 years of experience in mechanical design and automation systems integration. Strong knowledge of manufacturing processes and mechanical systems integration. Skilled in CAD and simulation tools. Additional Preferred Qualifications Experience with robotic automation systems and integration into manufacturing workflows. Familiarity with designing feeding mechanisms, part presentation systems, and end-of-arm tooling (EOAT) for robotics. Exposure to Autonomous Mobile Robots (AMRs) and other robotic mobility solutions. Understanding of sensors and actuators commonly used in automation (vision systems, force-torque sensors, linear actuators). Experience with plant simulation tools such as Siemens Plant Simulation or FlexSim. Qualification : Bachelors or Masters degree in Mechanical Engineering, Mechatronics, or related fields.

Job Description You will be part of ACE India, in the P- Core design team driving Intel's latest CPU's in the latest process technology. In this position, you will be responsible for timing analysis and convergence of complex partitions. Your responsibilities will include but not limited to: 1. Responsible for timing execution and convergence including setup and hold for over 5GHz Freq and low-power digital designs. 2. Deep understanding of Static timing analysis concepts 3. Timing Convergence across all HVM targets 4. Closely work with SD, Integration and Floor plan teams Qualifications Qualifications You must possess a master s degree in electrical or Electronics Engineering with at least 8 or more years of experience in related field or a bachelor s degree with at least 10 years of experience. Technical Expertise in Static Timing Analysis is preferred. Should have minimum of 2 years experience in leading the Team of at least 3-4 people Preferred additional skills Experience of handle complex core design, high-speed designs Timing signoff flows/tools experience both/either Synopsys/Cadence tools Very good knowledge on Timing tools, flows and methodology Ability to handle new feature feasibility studies SD flow knowledge would be plus Familiarity with Verilog/VHDL Tcl, Perl, Python scripting Strong verbal and written communication skills Inside this Business Group The Core and Client Development Group (C2DG) is a worldwide organization focused on the development and integration of SOCs, Core , and critical IPs that power Intel's leadership products, driving most of the Client roadmap for CCG, Delivering Server First Cores that enable continued growth for DCG and invest in future disruptive technologies. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Qualification : You must possess a masters degree in electrical or Electronics Engineering with at least 8 or more years of experience in related field or a bachelors degree with at least 10 years of experience.

Job Title: Design Engineer Location: Bengaluru, Karnataka No. of Positions: 1 2 Industry: Home Automation & AV, Building Automation Joining: Immediate About EBSL Automat Pvt. Ltd. EBSL Automat is a leading provider of innovative home automation solutions, dedicated to enhancing everyday living through intelligent technologies. With a strong presence in the smart living and building automation industry, we offer an exciting and collaborative environment for engineering professionals to grow, innovate, and contribute to transformative projects. Position Overview We are looking for a Design Engineer with a passion for CAD modeling, automation, and system development. This role involves collaborating with engineering, drafting, and operations teams to develop accurate, efficient, and high-quality design solutions. If you're technically inclined, detail-oriented, and eager to contribute to cutting-edge smart automation systems, this opportunity is for you. Key Responsibilities Assist in the development and implementation of CAD modeling and drafting standards for consistent documentation and design. Collaborate with cross-functional teams to incorporate Design for Manufacturability (DFM) and Design for Assembly (DFA) into models and technical drawings. Continuously improve design automation processes to boost efficiency and accuracy. Support engineering operations with tools like spreadsheets, parts lists, BOM (Bill of Materials) generation, and calculation templates. Develop internal system procedures to maintain high-quality standards aligned with industry best practices. Document technical procedures, user manuals, and training materials. Provide technical training and support to team members when needed. Contribute to other engineering or development projects as assigned. Skills & Experience Must-Have: Bachelor's degree in Electrical Engineering or a related field. 1 4 years of relevant experience in industrial or design automation. Good verbal and written communication skills. Team player with the ability to work under tight deadlines. Strong attention to detail, creative problem-solving skills, and analytical thinking. Proficiency in CAD software and understanding of design principles. Experience with engineering tools, ERP systems, and MS Office Suite (Excel, Word, Outlook). Preferred/Good-to-Have: Experience in CAD automation or engineering application development (2+ years preferred). Ability to work as a full-stack developer (desktop, web, client platforms) is a plus. Passion for programming and self-driven learning. Ability to work in flexible shifts as required. Familiarity with home automation or building systems is advantageous. Who Can Apply Candidates with 1 4 years of relevant experience. Freshers with strong academic backgrounds and a passion for design & automation are also encouraged to apply. If you're looking to contribute to the future of intelligent living while advancing your engineering career, we invite you to be part of the EBSL Automat journey. Qualification : Bachelor's degree in Electrical Engineering or a related field

We are seeking an experienced and highly motivated IO DFx Architect/Lead to join our team and lead the Design for Excellence (DFx) efforts for Physical Layer (PHY) interfaces in next-generation PHY. As a PHY DFx Architect/Lead, you will be responsible for driving DFx principles, including Design for Test (DFT), Design for Manufacturability (DFM), and Design for Debug (DFD), into the development of complex PHY designs. You will collaborate with cross-functional teams to ensure that PHY designs are optimized for quality, performance, reliability, and ease of integration into systems, while reducing time to market and ensuring manufacturability.In this leadership role, you will guide the team in the application of best practices in DFx and contribute to the continuous improvement of processes and methodologies, helping to deliver world-class PHY products.Lead the DFx (Design for Excellence) activities for Physical Layer (PHY) interfaces, ensuring designs are optimized for testability, manufacturability, debugging, and reliability. Understand IP and SOC architecture spec and define DFx requirements. Work with SOC and adjacent IP architects in ensuring DFX compliance across IP boundaries and SOC level DPM/coverage targets.Hands on coding of DFx features and flow clean upCollaborate with hardware design, verification, and manufacturing teams to define and implement DFx methodologies that improve design quality, reduce cost, and accelerate time to market.Oversee the integration of Design for Test (DFT), Design for Manufacturability (DFM), and Design for Debug (DFD) techniques in PHY design processes to ensure the ease of testing, manufacturability, and post-silicon debugging.Collaborate with Validation Architect to develop and implement comprehensive test and validation strategies to ensure that PHY systems meet industry standards (e.g., JEDEC, IEEE, PHY compliance) ,customer requirements, regulatory requirements, and industry certifications..Enable debug features on silicon to ensure smooth debuggabilityDrive PHY DFx changes and improvements based on feedback from production, test, and field data, working closely with manufacturing teams to ensure smooth transition from design to production.Stay up to date with industry trends, emerging test and debug technologies, and best practices, and incorporate them into design practices.Define and implement scan-based testing, boundary scan, and other DFT strategies to ensure that the PHY designs are fully testable and meet production-level testing requirements.Work with cross-functional teams to establish best practices for DFM to ensure that the PHY design is cost-effective and manufacturable at scale, minimizing yield loss and improving manufacturing efficiency.Promote and implement Design for Debug (DFD) techniques, ensuring that designs have appropriate debug hooks and are easy to troubleshoot both pre-silicon and post-silicon.Mentor and provide technical leadership to junior engineers in the areas of DFx methodologies and best practices.Drive collaboration between design, verification, and test teams to integrate DFx strategies into the overall development flow.Provide regular reports and updates to management on the progress of DFx initiatives, including key performance metrics and any challenges encountered.Drive problem solving and come up with innovative solutions. Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Master of Science (or a Master of Technology) degree in Electrical Engineering with more than 10 years of relevant industry experience or a Bachelor of Science (Bachelor of Technology) degree in Electrical Engineering with more than 12 years of relevant industry experience. Hands on experience in IP DFx RTL development, timing closure, and flows Working knowledge of RTL coding in Verilog/System Verilog and Debug in OVM/UVM based verification environment Experience in DFx features such as Structural Scan, BSCAN, MBIST, JTAG etc. Good understanding of industry standard DFx flows and compliance methodologies like DUVM, BSDL, ATPG, and GLS Preferred:- To have Mixed Signal IP DFx experience and/or IO DFx experience and/or post-silicon experience Preferred to have exposure in one/more of interface IPs like DDR/LPDDR/UCIe/HBM Preferred to have experience in driving small team of junior engineers and task forces. Need to be a key team player, while being highly energetic and motivated, independent, and self-driven. Inside this Business Group In the Design Engineering Group (DEG), we take pride in developing the best-in-class SOCs, Cores, and IPs that power Intel s products. From development, to integration, validation, and manufacturing readiness, our mission is to deliver leadership products through the pursuit of Moore s Law and groundbreaking innovations. DEG is Intel s engineering group, supplying silicon to business units as well as other engineering teams. As a critical provider of all Intel products, DEG leadership has a responsibility to ensure the delivery of these products in a cost efficient and effective manner. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.It has come to our notice that...

Company: Qualcomm India Private Limited Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Qualcomm, a leading innovator in technology, is pushing the boundaries of possibility to drive the digital transformation and create a smarter, more connected future. As a Hardware Engineer at Qualcomm, you will play a key role in designing, optimizing, verifying, and testing a wide range of electronic systems. This includes everything from circuits, mechanical systems, digital/analog/RF/optical systems, and test systems, to FPGA and DSP systems. You will collaborate with cross-functional teams to develop solutions that meet performance requirements and launch world-class products. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, or a related field, with 3+ years of experience in Hardware Engineering or a similar field. OR Master's degree in Computer Science, Electrical/Electronics Engineering, or a related field, with 2+ years of experience in Hardware Engineering or a related field. OR PhD in Computer Science, Electrical/Electronics Engineering, or a related field, with 1+ year of experience in Hardware Engineering or a related field. Experience: 7 to 10 years Key Responsibilities and Skills: Physical Design Expertise: Extensive experience with block-level physical design, including a strong understanding of the PnR cycle. Industry-Standard Tools: Proficiency in industry-standard physical design tools like ICC2 and Innovus. Signoff Tools: Solid understanding and hands-on experience with signoff tools such as PrimeTime, Redhawk, and Calibre. Technical Leadership: Ability to guide and mentor junior engineers, helping them resolve technical challenges effectively. Tools & Scripting: Experience with tools like ICC/Innovus, PrimeTime (PT), StarRC, Redhawk, and Calibre DRC/LVS. Proficient in scripting languages such as TCL and Perl.

Senior Lead Engineer Structural Analysis (Hybrid) Location: Bangalore, Karnataka, India Job Type: Full-time Company: Collins Aerospace (Raytheon Technologies) Experience: 5 8 years Job Overview We re looking for a Senior Lead Engineer (Stress) to join our Advanced Structures business unit. This role leads structural analysis for New Product Introduction, redesign, and technology programs. Support includes a wide range of aerospace components including ETRAS systems. Responsibilities Lead stress analysis using FEA tools (Ansys) and classical hand calculations. Prepare structural analysis documentation, stress reports, and certification data. Collaborate with design, manufacturing, and quality teams. Investigate failures and provide technical resolutions. Contribute to process improvements, automation, and tool development. Ensure on-time and quality delivery of engineering work products. Basic Qualifications Bachelor s/Master s in Mechanical or Aerospace Engineering. 5 8 years of structural analysis experience using Ansys Workbench. Strong background in fatigue, stress, and vibration analysis. Skilled in classical calculations and report writing. Preferred Qualifications Experience in hydraulic/electro-mechanical component analysis. Proficiency with Mathcad, Python, or Excel VBA. Familiarity with aerospace material properties and treatment processes. Benefits Transportation & meal vouchers Group life, health, and personal accident insurance 18 days vacation + 12 days contingency leave National Pension Scheme and car lease options Employee scholar program Equal Opportunity Collins Aerospace is an equal opportunity employer and values diversity. All qualified applicants will receive consideration without regard to race, gender, disability, or veteran status. Apply Now Be part of our aerospace revolution. Apply today and help us redefine flight for the future.

Experience: 4+ Years (Bachelor s) | 3+ Years (Master s) | 2+ Years (PhD) Company Overview As a leading technology innovator, Qualcomm pushes the boundaries of what s possible to enable next-generation experiences and drive digital transformation, helping to create a smarter, connected future for all. Qualcomm Hardware Engineers collaborate with cross-functional teams to plan, design, optimize, verify, and test cutting-edge products, enabling transformative solutions in the hardware space. Role Overview The SRAM Design Engineer will be responsible for the design, verification, and optimization of SRAM (Static Random-Access Memory) blocks for advanced process nodes. This role requires deep expertise in custom circuit design, low-power methodologies, and process technology trends. The ideal candidate will work on complex memory designs, collaborate with cross-disciplinary teams, and contribute to Qualcomm's next-generation hardware solutions. Key Responsibilities Design and develop SRAM circuits for advanced technology nodes (FinFET and beyond). Perform schematic design, simulation, and verification of memory circuits to meet performance, power, and area (PPA) targets. Optimize designs for low-power, high-speed, and high-density applications. Collaborate with layout engineers to ensure design compliance with foundry design rules and assist in layout optimization. Analyze and resolve design for manufacturing (DFM) and yield issues. Work closely with cross-functional teams (architecture, verification, and technology teams) to meet design specifications and performance requirements. Utilize SPICE simulations and other EDA tools to validate circuit functionality and robustness under process, voltage, and temperature (PVT) variations. Contribute to the post-silicon bring-up and debugging of memory-related issues. Qualifications Minimum Requirements: Bachelor s degree in Computer Science, Electrical/Electronics Engineering, or a related field and 4+ years of relevant work experience. OR Master s degree in Computer Science, Electrical/Electronics Engineering, or a related field and 3+ years of relevant work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, or a related field and 2+ years of relevant work experience. Technical Skills: Expertise in SRAM design, simulation, and verification. Strong knowledge of circuit design principles, including timing, noise, and power analysis. Experience with advanced process technologies (FinFET, 7nm, 5nm, 3nm). Proficiency with SPICE-based simulators and EDA tools for circuit analysis. Understanding of memory architecture, power management techniques, and design for yield (DFY) methodologies. Familiarity with DFM practices, chip integration, and physical design constraints. Preferred Qualifications: Experience in low-power SRAM design and assist circuits (read/write assist). Knowledge of self-repairing memories and redundancy schemes. Exposure to silicon validation, post-silicon debug, and memory characterization. Excellent problem-solving and communication skills.

Job Title: Mechanical Design Engineer Location: Bengaluru Experience Required: 2 to 4 years Minimum Qualification: Bachelor of Engineering (BE) Key Skills Mechanical Product Design 3D Modeling (NX or SolidWorks) Engineering Drawing & Documentation Prototyping & Testing FEA & Tolerance Stack-Up Analysis DFMEA & Risk Assessment Cross-functional Collaboration Supplier & Manufacturing Support Job Summary We are looking for a talented and detail-oriented Mechanical Design Engineer to support the development of innovative mechanical products from concept through to production. The ideal candidate will have 2 4 years of hands-on experience in mechanical design, a strong grasp of engineering principles, and a passion for problem-solving and continuous improvement. Key Responsibilities Support mechanical design efforts for new product development from concept to launch. Create detailed 3D models, engineering drawings, and Bills of Materials (BOMs) using NX or SolidWorks. Build and test prototypes to validate design concepts and performance. Collaborate closely with electrical, software, industrial design, and manufacturing teams. Evaluate material choices, manufacturing processes, and cost implications during the design phase. Perform tolerance stack-up analyses, finite element analysis (FEA), and other engineering calculations. Participate in and support design reviews, DFMEA sessions, and risk assessments. Liaise with suppliers and contract manufacturers to ensure design integrity through production. Maintain accurate documentation in line with engineering change control and regulatory requirements. Contribute to continuous improvement initiatives and intellectual property (IP) development. Qualification : Bachelor of Engineering (BE)

Job Description: Experienced in at least one of the industry wide 3D CAD Design packages with wire harness design routing add-ons (Unigraphics NX, CATIA, etc.) Proficiency in NX Electrical Workbenches, Part and Assembly Design. Experience within the automotive industry. Work experience in PDM/PLM tool Good Communication skills German language proficiency would be an added advantage. Good understanding of automotive electrical packaging concept and Electrical/mechanical interfaces. Educational Qualification: B.E / B.Tech (Automobile/Mechanical/Electrical Engineering) Number of Positions: 10 Skills: UGNX / Catia

Job Description: Experience in Low & High voltage w/h Creation of 3D CAD models for Electrical Routing, Schematic, Sheet metal or plastic components, PDM & PLM exposure. Experience with Automotive product development. Good in NX wiring harness, Electrical Routing & Sheetmetal & Part modeling module. Educational Qualification: BE / ME / B.Tech /M.Tech Number of Positions: 2 Qualification : BE / ME / B.Tech /M.Tech

Hardware Engineer - Customer Hardware Design Automation Company Qualcomm India Private Limited Job Area Engineering Group > Hardware Engineering General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world-class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or a related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or a related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or a related field and 1+ year of Hardware Engineering or related work experience. Job Responsibilities Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm chipset-based solutions. The candidate will contribute to the development of Customer Hardware design automation tools. Responsibilities include: Developing, enhancing, and maintaining tools that support the design and validation of PCB platforms using Qualcomm chipsets. Collaborating with cross-functional teams to ensure tools meet high standards of quality and performance for PDN, Signal Integrity, and PCB validation tools. Working across applications including Laptops, IoT, and Automotive. Preferred Qualifications Experience in tool development for hardware design automation. Experience in platform-level automated debug solutions. Familiarity with telemetry analytics, Windows debug tools, and analyzers. Knowledge of thermal and power management. Experience in platform validation and debug tools. Proficiency in system automation. Equal Opportunity Employer Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, you may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Important Note to Agencies Qualcomm s Careers Site is for individuals seeking employment at Qualcomm. Staffing and recruiting agencies, and individuals being represented by an agency, are not authorized to use this site to submit profiles, applications, or resumes. Unsolicited resumes/applications submitted by agencies will not be accepted. Qualcomm does not accept any responsibility for fees related to unsolicited resumes/applications.

Senior Memory Design Engineer Company Arm Location Noida, India Job Description This opening is for a Senior Memory Design Engineer in our PHYSICAL IP MEMORY group in Noida. We work on innovative memory architectures in leading-edge technology nodes to enable the best Arm Systems across all markets. As a memory design professional, this position is a rare opportunity to work with our successful circuits, characterization, and layout team, and gain a deep understanding of memory usage in SoCs based on Arm cores. You will discover a wide variety of circuit innovations while working on different types of memories in cutting-edge process technologies. Responsibilities In this role, you will be working in the following areas: Work on memory architecture development in the latest technologies. Transistor-level full-custom design and collaboration with the physical design team for layout realization. Develop new design features and perform circuit/layout optimizations to meet Performance, Power, and Area targets. Lead memory design verification and characterization activities. Ensure high-performance memory designs with the lowest possible power, as needed for Arm CPUs, GPUs, and SOCs. Required Skills and Experience 5-8 years of proven experience in memory design. Strong interest and command of basic electronics (Diodes, RC Circuits, CMOS, etc.). Solid understanding of digital electronics fundamentals (Flip-Flops, Latches, Decoders, Multiplexers). Understanding of setup and hold time concepts. In-depth knowledge of memory fundamentals, especially single-port SRAM: Circuit design (Bitcell, WL decoder, Sense Amp, Self-time, Assist, Low power features, DFT features). Good understanding of technology trade-offs in deep sub-micron technologies. Self-motivated, hardworking, and positive outlook. Strong organizational skills with attention to detail. Nice-to-Have Skills and Experience Understanding of advanced process technology nodes and memory product layout implementation. Experience with shell scripting, machine learning (ML), and automation. Knowledge of statistical simulations (e.g., Monte Carlo). What Arm Offers Arm is committed to global talent acquisition and offers an attractive relocation package. With offices worldwide, Arm is a diverse organization of dedicated, creative, and hardworking engineers. By fostering a dynamic, inclusive, and meritocratic workplace where everyone can grow and succeed, we encourage our people to make exceptional contributions to Arm's success in the global marketplace. Accommodations at Arm If you need support or an accommodation to Be Your Brilliant Self during the recruitment process, please email accommodations@arm.com. By sending the requested information, you consent to its use by Arm to arrange appropriate accommodations. All accommodation requests will be treated with confidentiality, and information will only be disclosed as necessary to provide the accommodation. Examples of support include breaks between interviews, having documents read aloud, or office accessibility. Hybrid Working at Arm Arm s hybrid working approach is designed to create an environment that supports both high performance and personal wellbeing. We believe in bringing people together face-to-face to enable faster work while recognizing the value of flexibility. Hybrid working patterns depend on team and role requirements, which will be discussed upon application. Some flexibility might be limited by legal, regulatory, tax, or other considerations. Equal Opportunities at Arm Arm is an equal opportunity employer, committed to fostering an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals and do not discriminate based on race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status.

Job Title: Senior ATE Test Engineer Manufacturing & Product Engineering Job Description: Intel is seeking a Senior ATE Test Engineer to drive the testability and manufacturability of integrated circuits from feasibility to high-volume production (HVM). The role involves developing and validating test methodologies, debugging functionality and performance issues, and optimizing test processes for yield and cost efficiency. The engineer will work closely with design, process development, fab, assembly, and manufacturing teams to ensure seamless production ramp-up and quality assurance. Key Responsibilities: Test Development & Debugging: Design, develop, and validate testability circuits and test flows for new products. Debug functionality and performance issues to root cause using Automatic Test Equipment (ATE). Interface with design, DFx (Design for Test, Debug, Manufacturing), and product teams to drive test development. Manufacturability & High-Volume Ramp (HVM): Collaborate with fab, assembly, test factories, and quality/reliability teams to enable smooth production ramp-up. Perform ATE device characterization, define datasheet specifications, and conduct yield analysis. Analyze early customer returns and drive test hole closure activities to enhance quality and reliability. Production Test Optimization: Drive test time reduction by analyzing fallout data and balancing product cost optimizations. Implement bin split and die-level cherry-pick (DLCP) strategies to optimize product supply. Ensure manufacturability through process and spec corner analysis to resolve yield issues before mass production. Hardware & Software Development: Develop and debug complex software programs for test conversion and test automation. Create and validate test hardware solutions for production testing. Optimize component production relative to quality and cost constraints. Qualifications & Experience: Educational Requirements: B.Tech/M.Tech in Computer Science, Electrical, or Electronics Engineering or related fields. Technical Expertise: ATE Test Engineering: Strong expertise in Automatic Test Equipment (ATE) development and debug. DFT & Test Methodologies: Knowledge of DFT architectures and methodologies including Analog DFT, JTAG, etc. Understanding of test engineering processes and tester debugging techniques. Debugging & Validation: Hands-on experience with design/validation and advanced debugging skills. Expertise in Advantest 93K, Teradyne Ultraflex, J750, and related test platforms. Manufacturing Process & Yield Analysis: Experience in yield analysis, bin splitting, and test time optimization. Ability to analyze process corners and drive manufacturing readiness. Soft Skills: Excellent problem-solving skills, teamwork, and communication. Strong interpersonal and planning skills for cross-functional collaboration. About Intel s Manufacturing & Product Engineering (MPE) Group: The MPE team is responsible for test development across Intel s product segments, contributing to 95% of Intel s revenue. The team delivers pre-production test suites and physical debug capabilities to enable high-quality, high-volume manufacturing. Intel s Commitment to Diversity & Inclusion: Intel is an equal opportunity employer that values diversity and welcomes applications from all qualified candidates. Intel offers a competitive compensation and benefits package, including: Competitive salary, stock options, and performance-based bonuses. Comprehensive health, retirement, and vacation benefits. Cutting-edge technology and career growth opportunities. Qualification : B.Tech/M.Tech in Computer Science, Electrical, or Electronics Engineering or related fields.

Job Description The Client Development Group (CDG) is looking for Physicial Design Engineers with following Responsibilities - Creates bottoms up elements of chip design including but not limited to Device cell and block level layouts, Block level floor plans, abstract view generation, RC extraction and schematic layout verification. Debug using phases of physical design development including parasitic extraction ,clock generation, custom polygon editing, auto place and route algorithms, floor planning, full chip assembly, RV DFM Density and verification. Troubleshoots design issues and applies proactive intervention. May schedule staffing execution and verification of complex chips development and execution of project methodologies and/or flow developments. Qualifications You should possess a BE or BTech or equivalent technical degree in Electronics Electrical engineering with knowledge in Layout Designing. Experience, Skills, Additional qualifications include Proficiency in multiple levels of layout design which includes data path register files and standard cell designs. Proficiency in floor planning activities which include FUBunit level assembly routing and integration of custom blocks into the FC floorplan. Ability to comprehend issues of RC delay electromigration, selfheating and cross capacitance. Ability to recognize failure prone layout structures and proactively contact engineers for guidance and produce electrically robust layout. Inside this Business Group The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth. Other Locations IN, Hyderabad Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel s offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel Qualification : You should possess a BE or BTech or equivalent technical degree in Electronics Electrical engineering with knowledge in Layout Designing.

Job Title: Junior Engineer Mechanical Design (Industrial Automation Projects) Reports To: Senior Engineer Mechanical Design Job Purpose To assist in the design and drafting of Special Purpose Machines (SPMs) and industrial automation systems by supporting the mechanical design team in converting concept designs into detailed manufacturing drawings. Key Responsibilities Support the mechanical design team in developing detailed mechanical designs from initial concepts. Prepare accurate manufacturing and assembly drawings for industrial automation systems and SPMs. Collaborate with cross-functional teams to ensure design intent and manufacturability. Revise and update designs based on feedback and design improvements. Qualifications & Skills Education: B.E. in Mechanical Engineering OR Diploma in Tool & Die Making (NTTF) OR Diploma in Mechanical Engineering with relevant experience Technical Knowledge: Basic understanding of mechanical and manufacturing engineering principles Familiarity with machining processes Fundamental knowledge of pneumatic and hydraulic systems Software Skills: Basic proficiency in 3D CAD tools such as SolidWorks, Solid Edge, or similar Working knowledge of Microsoft Office tools (Word, Excel, PowerPoint) Communication: Strong communication skills in English Experience: 0 1 year of experience in the machining or manufacturing industry A strong desire and aptitude to grow into a mechanical design role

Job Description: As a Staff Engineer in Arm's Solutions Engineering group, we like to think we are not just crafting sophisticated SoCs, but we are defining future chip design techniques. Not only do we improve the power, performance, and system integration of our products, but we also craft the design flows, influence Electronic Design Automation (EDA) tools, and build the knowledge base that makes custom SoC and CPU chip design possible. At Arm, our work goes beyond multiple divisions where we drive improved implementation for Arm and our partners. A key component of this is around the development of comprehensive implementation and analysis methodologies. Responsibilities: Synthesis, Physical design, and implementation of CPU cores, system interconnect, and other Arm IP. Analyze design timing, area, and power to help improve the quality of Arm IP. Develop and deploy new methodologies to improve implementation efficiency and results. Support and develop detailed implementation analysis and data-mining methodologies. Work with implementation and physical IP RTL design teams to drive analysis and optimization of our IP. Converting R&D concepts into real implementation solutions. Enable our partners to achieve the best possible quality of results. Required Skills and Experience: Bachelor s or Master s degree equivalent in Electrical Engineering, Computer Engineering, or other relevant technical fields. 8+ years of proven experience in ASIC Implementation, Physical design, STA and Timing closure, Structured clock tree, PDN analysis, DFM, and Physical verification. Possess a high level of dedication, initiative, and problem-solving skills. Experience in crafting and adopting new silicon implementation techniques and methodologies, and promoting their use with international teams. Previous experience in and knowledge of the entire IC design flow, from RTL through to GDS2. Experience working closely in top and block-level Synthesis, Floorplanning, Place and Route, CTS, logical and physical optimization, timing closure, and power analysis flows. Proven programming and scripting skills (e.g., Tcl, Perl, and R). Nice To Have Skills and Experience: Knowledge around Arm-based SoCs! Experience with a wide range of programming, scripting & data presentation languages (e.g., Tcl, sh, csh, make, R, C, C++, Java, JS, HTML, Perl, Python, and Ruby). Experience with low-power design techniques (power gating, voltage/frequency scaling). Experience with Verilog RTL design. Experience with ATPG tools and/or production testing. In Return: Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals and do not discriminate on the basis of any characteristic. #LI-KR2 Qualification : Bachelors or Masters degree equivalent in Electrical Engineering, Computer Engineering, or other relevant technical fields.

Company: Qualcomm India Private Limited Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Experience in micro architecture and requirements/implementation for automotive designs (focused on functional safety) and their Safety Analysis work products like concept FMEDA, DFA, DFMEA, FTA, FMEDA, etc. including FuSa compliant IP development and third-party IP compliance/deliverables/DIA. Responsibilities shall include the following: Developing a system level safety concepts and requirements for ADAS and IVI use cases with customer implementations in mind and to integrate Qualcomm s hardware in leading Automotive OEM and Tier 1 safety critical systems. Work in collaboration with 3rd party, Customer, and Automotive Stack suppliers, Hardware component suppliers (PMIC, DRAM, Sensor, etc) to ensure all aligned customer system level requirements are met Work with IP and SoC teams on the implementation of Technical Safety Concepts (TSCs) on Qualcomm s Snapdragon automotive hardware. Work with various technology teams on architectural features that would enable targeted safety levels (ASIL B to ASIL D, depending upon the technology team and system level requirements) to meet customer targets Conducting safety analyses, both quantitative and qualitative, fault campaigns on automotive hardware designs and identify areas of improvement. Responsibilities will include leading functional safety related activities for SoC development and ensure ISO 26262 compliance with respect to SoC architecture, development processes and work products. Work closely with SoC Design and IP teams, Software team, Quality teams, the functional safety manager(s) as well as customers to ensure the functional safety process is executed and documented. Working with vendors and partners to ensure functional safety requirements are fulfilled by the components that they provide Work with internal and external functional safety assessors to ensure compliance with ISO 26262 Create functional safety collateral for customers viz. Functional Safety Manual, Safety Analyses Reports, dedicated application notes etc. Supporting customer assessments of our safety features and recommending HW and SW based solutions that meet overall system targets. Working closely with customers and supporting them on various functional safety related aspects Minimum Qualifications Bachelor s degree in engineering, Information Systems, Computer Science, or related field. 8+ years Systems Engineering, SoC Integration, Verification, or related work experience. Collaborative work experience with good communication skills involving customers, vendors, and internal development teams. Structured problem-solving capability and ability to work with teams on root cause analyses. Preferred Qualifications 5+ years Automotive experience and familiarity with Safety work products, experience with Functional Safety Hardware and/or Software development in semiconductor industry meeting IS0 26262/ IEC 61508 standards. Prior automotive experience in ADAS and self-driving systems preferred. System level Functional safety analysis experience on Hardware/Software components integration preferred SoC/IP integration or verification with good understanding of SoC Architecture and IP design experience preferred Requirements Management Tools and establishing traceability for functional safety requirements e.g. DOORS, etc. Familiarity with Failure Modes and Effect Analysis (FMEA) and Fault Tree Analysis (FTA) is required experience using tools to perform FMEA, FTA preferred Familiarity with hardware failure rate calculation (FMEDA) experience using Siemens 29500 and/or IEC 62380 preferred Relevant Safety Certification is desired e.g. CFSE, CFSP Qualification : Bachelors degree in engineering, Information Systems, Computer Science, or related field.