Electro-mechanical Packaging Design Engineer Job in Boeing
Electro-mechanical Packaging Design Engineer
- Bengaluru, Bangalore Urban, Karnataka
- Not Disclosed
- Full-time
Job Description
Position Responsibilities:
- Executing projects independently without supervision
- Working on Electronic Line Replaceable Unit design & development
- Analyzing Customer & System Requirements to develop basic mechanical packaging and printed circuit design approach for power supplies and control units
- Collaborating & communicating with cross functional teams and all stakeholders, especially electronics circuit designers, PCB/PWA, Thermal, EMI/EMC, Systems.
- Identifying and tracking technical performance metrics to measure progress and ensure compliance with requirements
- Providing technical guidance and mentoring team during project execution
- Validating designs through thermal cycling, dynamic analyses and testing
- Executing end-to-end project management, including some configuration management and change control
Employer will not sponsor applicants for employment visa status.
Desired Skills:
- Must understand the complete product development lifecycle, capture requirements, and provide technical guidance and decisions.
- Hand on experience in Mechanical Chassis design (End-to-End) for Rugged/Sheet metal LRU and test equipment.
- Experience in detailed development of modules, chassis, heat sinks, fans and mechanical fasteners and COTS selection for connectors etc.
- Experience in requirements capture for printed circuit board (PCB) layout, electrical interconnect, route/Via/keep out, critical thermal component, mounting holes, heat sink placement design.
- Hand on experience in mechanical tolerance and stack up analysis.
- Hand on experience on DFM/DFA/DFX
- Hand on experience on chassis level EMI/EMC calculation as an added advantage
- Experience in Aerospace Material selection, Manufacturing processes and finish
- Experience in Aerospace - DO-160 and MIL-STD-810 is required.
- Experience with static and dynamic structural analysis, solder joint / lead fatigue analysis, thermal analysis (Passive/Active cooling) as an added advantage.
- Experience on reliability of electronic component selection and design for reliability is an added advantage.
- Understanding of configuration management, requirements traceability (DOORS) and related processes is an added advantage
- Technical team leadership and mentoring skills. Ability to coordinate multi-discipline team.
- Experience in using Engineering design tools, Creo, Catia V5, NX.
- Knowledge or hands on experience of Analysis tools, Nastran/Patran, Flotherm -12.1 is an added advantage
- Experience in MBE and 3DX is an added advantage.
Typical Education & Experience:
Mechanical Engineering degree with 5 to 9 years of related work experience or a Master's degree with 4 to 8 years related work experience or an equivalent combination of education and experience..
Relocation:
RELOCATION BENEFITS IF INDICATED ARE LIMITED TO IN-COUNTRY MOVES AND ARE NOT AVAILABLE FOR OVERSEAS RELOCATION. THERE IS NO EXPATRIATE PACKAGE ASSOCIATED WITH THIS POSITION.
Equal Opportunity Employer:
Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.
Experience Level
Individual Contributor
Contingent Upon Program Award
No, this position is not contingent upon program award
Schedule
Full time

