Physical Design _full Chip Design (automotive Domain Expert) Job in Tessolve

Experience: 7 to 18 years

Education: Any Engineering Degree or equivalent practical experience.

No Of Position: 1

Location: Bangalore

Job Description:

• Must be hands-on technical expert.
• Strong written and oral communication skills.
• Experienced in deep sub-micron designs ( Preferably below 28 Nm like 16/14/12/7 nm).
• Experienced in leading SOC timing closure and physical design tasks with deep technical knowledge in all.
• Experienced in Full Chip PNR & Partitioning / Bump Placement.
• stages of the design (floor planning, placement, clock-tree-syntheses CTS, routing, noise reduction/cross-talk, extraction, IR drop, IO Pad-ring, LVS/DRC and other physical and electrical checks).
• Experience in Low power and high performance design.
• Experience in designing for Automotive industry.
• Able and willing to work with teams across sites and with cross-functional teams.
• Able to collaborate, extract information and deliver results.
• Should have sound understanding of all the Physical Design requirements.
• Should be able to comprehend architecture, architecture limitations from Physical Design perspective, schedule, volume of the task and personnel requirement.
• Strong debug skills and Automation savvy.
• Expert in tools Cadence Encounter/ Magma Talus/Synopsys ICC / Cadence Innovus.

Experience:

• Full Chip SOC.