Test Engineer Digital, Analog & Mixed Signal Job in Tessolve

Functional Area : Post Silicon Validation

Experience : 2+ Years

Qualification : BE / B.Tech / Diploma (ECE / EEE stream)

Location : Visakhapatnam, AP, India

Looking for candidates in any of the below domain experience :

• Hardware design engineer Board design (Digital, Mixed signal, RF).
• Hardware Application engineer.
• FPGA testing using JTAG / BoundaryScan.
• System level testing.
• Embedded testing & debugging.

Skill set (Any one of the following) :

• RFIC: Experience of testing RF circuits (LNA, PLL, PA and should be able to test RF parameters like phase noise, gain, ACPR, Inter-Modulation Distortion).
• PMIC: Power management systems design / debug / testing / integration of Buck/Boost/Buck-boost/LDOs, precision references, battery charge controllers, lighting systems, current sources and sinks, and crystal oscillators.
• Mixed Signal: Experience with Mixed-signal blocks like ADC, DAC and PLL blocks and their measurement techniques such as INL, DNL, Gain and Offset Error, SFDR, THD+N, ICN, Jitter, Phase noise, Lock time etc.
• High Speed: Experience with High-Speed SERDES (USB, DDR, SATA, PCIe, SGMII/QSGMII, MIPI PHY , HDMI, LVDS,eDP). Knowledge on Signal Parameters like eye diagram, Overshoot, Undershoot, DC Threshold multi-crossing etc.
• Hardware Board Design: Fundamental understanding and hands-on experience with analog and digital electronics and help routing on PCB with SI analysis.
• FPGA: Design/Integrate application circuits using FPGA/Microcontroller programming and familiar with process like ICT, JTAG, I2C, SPI and AXI.
• FPGA: Design/Integrate application circuits using FPGA/Microcontroller programming and familiar with process like ICT, JTAG, I2C, SPI and AXI.
• System Level Testing: Extract the system level parameters of SOC s/Application circuits or Transceivers. Determine the best way a test can be performed in order to achieve 100% test coverage of all components using different test processes Designing test plans, developing test cases/scenarios/usage cases, and executing these cases.

Debug Skills :

• Experience in troubleshooting and ability to resolve issues in test setup.
• Ability to work with common lab equipment such as power supplies, oscilloscopes, spectrum analyzers, logic analyzers, JTAG debugger, frequency counters, etc.

Software Skills (Any of the following) :

• Programming skills like C++ / C-Sharp (or equivalent).
• Knowledge on Labview / VEEpro / Python Automation software.
• Knowledge on Visual basic / VBA / Matlab.

Job Description :

• Test Engineer has to work with different teams for understanding the device datasheet and needs to come up with a detailed Test procedure/plan to test the chip.
• Need to interact with the PCB design team for developing the necessary hardware Test load board, bench board, and probe cards.
• He / She should develop the complete ATE test program to validate the chip.
• Close interactions with the chip design and DFT teams are a must during the device debug phase and bring up and need to validate all the device parameters with the specifications.
• In addition, Test engineer should involve in developing the test methodologies as required.

Role / Responsibilities :

• Develop ATE test solution for semiconductor IC s in different domains as Power management / Digital / Mixed signal or RF.
• Be a primary contact to interact with customer / vendors (design / support teams).
• Work with design / DFT team to develop the detailed test procedure from device data sheet.
• Develop and lead the hardware design activity (Probe cards / Final test load boards), develop schematics, provide placement / layout guidelines to PCB design engineer.
• First silicon verification and device bring up using ATE tools. Leading ATE s from Teradyne, Advantest etc., (Uflex, 93K etc).
• ATE software development as per test procedure document (C, C++, Perl, VB etc).
• Device characterization across temperature, voltage and process corners, and validate the chip against the specification.
• Responsible for releasing the Final production quality test program to the customer both wafer final test program.
• Interact with the customer on a daily basis and provide status updates through e-mails and conference calls.
• Responsible from the beginning to the Final test program release to production.
• Need to be good in communication to interact with customer.